About this book

With electromagnetic compliance (EMC) now a major factor in the design of all electronic products, it is crucial to understand how electromagnetic interference (EMI) shielding products are used in various industries. Focusing on the practicalities of this area, Advanced Materials and Design for Electromagnetic Interference Shielding comprehensively introduces the design guidelines, materials selection, characterization methodology, manufacturing technology, and future potential of EMI shielding.
After an overview of EMI shielding theory and product design guidelines, the book extensively reviews the characterization methodology of EMI materials. Subsequent chapters focus on particular EMI shielding materials and component designs, including enclosures, metal-formed gaskets, conductive elastomer and flexible graphite components, conductive foam and ventilation structures, board-level shielding materials, composite materials and hybrid structures, absorber materials, grounding and cable-level shielding materials, and aerospace and nuclear shielding materials. The last chapter presents a perspective on future trends in EMI shielding materials and design.
Offering detailed coverage on many important topics, this indispensable book illustrates the efficiency and reliability of a range of materials and design solutions for EMI shielding.

About the Author

Dr. Xingcun Colin Tong is a distinguished materials scientist and engineer, renowned for his expertise in electromagnetic interference (EMI) shielding and advanced materials. He has served as an EMI Materials Engineer at Laird Technologies, a company recognized for its innovative solutions in EMI shielding and thermal management. Dr. Tong joined Laird Technologies in 2006, bringing with him over two decades of experience in research and development, property analysis, performance characterization, and thermal management of electronic packaging.
His academic credentials include a Ph.D. and a Master’s degree in Materials Science, along with a Bachelor’s degree in Mechanical Engineering. Throughout his career, Dr. Tong has made significant contributions to the field, holding several patents and authoring over 30 technical papers. His work has been recognized with prestigious awards, such as the Henry Marion Howe Medal from ASM International in 1999, honoring his contributions to the development of advanced composite materials.
In addition to his professional achievements, Dr. Tong is an active member of several professional societies, including The Minerals, Metals & Materials Society (TMS), the Institute of Electrical and Electronics Engineers (IEEE), and ASM International, reflecting his ongoing commitment to advancing the field of materials science and engineering.

Table of contents

Electromagnetic Interference Shielding Fundamentals and Design Guide

Characterization Methodology of EMI Shielding Materials

EMI Shielding Enclosure and Access

Metal-Formed EMI Gaskets and Connectors

Conductive Elastomer and Flexible Graphite Gaskets

Conductive Foam and Ventilation Structure

Board-Level Shielding Materials and Components

Composite Materials and Hybrid Structures for EMI Shielding

Absorber Materials

Absorber Materials

Grounding and Cable-Level Shielding Materials

Special Shielding Materials in Aerospace and Nuclear Industries

Perspectives and Future Trends

Index

A Summary and References appear at the end of each chapter.

Bibliographic Information

• Authors
  Xingcun Colin Tong
• Publisher
  CRC Press
• Published:
  November 2008

• Hardback
• Number of Pages
  340
• No. of Illustrations
  114 B/W Illustrations
• ISBN:
   9781420073584

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